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 HAF2012(L), HAF2012(S)
Silicon N Channel MOS FET Series Power Switching
REJ03G1139-0400 Rev.4.00 Jul 13, 2007
Description
This FET has the over temperature shut-down capability sensing to the junction temperature. This FET has the built-in over temperature shut-down circuit in the gate area. And this circuit operation to shut-down the gate voltage in case of high junction temperature like applying over power consumption, over current etc.
Features
* * * * Logic level operation (4 to 6 V Gate drive) High endurance capability against to the short circuit Built-in the over temperature shut-down circuit Latch type shut-down operation (Need 0 voltage recovery)
Outline
RENESAS Package code: PRSS0004AE-A (Package name: LDPAK (L) )
4
RENESAS Package code: PRSS0004AE-B (Package name: LDPAK (S)-(1) )
4 1. Gate 2. Drain 3. Source 4. Drain 2 3
1
1 2 3
D
G
Gate Resistor
Temperature Sensing Circuit
Latch Circuit
Gate Shutdown Circuit
S
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 1 of 9
HAF2012(L), HAF2012(S)
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1% 2. Value at Ta = 25C Symbol VDSS VGSS VGSS ID ID (pulse) Note 1 IDR Pch Note 2 Tch Tstg Value 60 16 -2.8 20 40 20 50 150 -55 to +150 Unit V V V A A A W C C
Typical Operation Characteristics
(Ta = 25C)
Item Input voltage Input current (Gate non shut down) Input current (Gate shut down) Shut down temperature Gate operation voltage Symbol VIH VIL IIH1 IIH2 IIL IIH (sd) 1 IIH (sd) 2 Tsd VOP Min 3.5 -- -- -- -- -- -- -- 3.5 Typ -- -- -- -- -- 0.8 0.35 175 -- Max -- 1.2 100 50 1 -- -- -- 13 Unit V V A A A mA mA C V Test Conditions
Vi = 8 V, VDS = 0 Vi = 3.5 V, VDS = 0 Vi = 1.2 V, VDS = 0 Vi = 8 V, VDS = 0 Vi = 3.5 V, VDS = 0 Channel temperature
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 2 of 9
HAF2012(L), HAF2012(S)
Electrical Characteristics
(Ta = 25C)
Item Drain current Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol ID1 ID2 V (BR) DSS V (BR) GSS V (BR) GSS IGSS1 IGSS2 IGSS3 IGSS4 IGS (op) 1 IGS (op) 2 IDSS VGS (off) RDS (on) RDS (on) |yfs| Coss td (on) tr td (off) tf VDF trr tos1 tos2 Min 10 -- 60 16 -2.8 -- -- -- -- -- -- -- 1.0 -- -- 6 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- -- -- -- -- 0.8 0.35 -- -- 50 30 12 630 7.5 29 34 26 1.0 110 1.8 0.7 Max -- 10 -- -- -- 100 50 1 -100 -- -- 250 2.25 65 43 -- -- -- -- -- -- -- -- -- -- Unit A mA V V V A A A A mA mA A V m m S pF s s s s V ns ms ms Test Conditions VGS = 3.5 V, VDS = 2 V VGS = 1.2 V, VDS = 2 V ID = 10 mA, VGS = 0 IG = 100 A, VDS = 0 IG = -100 A, VDS = 0 VGS = 8 V, VDS = 0 VGS = 3.5 V, VDS = 0 VGS = 1.2 V, VDS = 0 VGS = -2.4 V, VDS = 0 VGS = 8 V, VDS = 0 VGS = 3.5 V, VDS = 0 VDS = 50 V, VGS = 0 ID = 1 mA, VDS = 10 V ID = 10 A, VGS = 4 V Note 3 ID = 10 A, VGS = 10 V Note 3 ID = 10 A, VDS = 10 V Note 3 VDS = 10 V, VGS = 0 f = 1 MHz ID = 5 A VGS = 5 V RL = 6 IF = 20 A, VGS = 0 IF = 20 A, VGS = 0 diF/dt = 50 A/s VGS = 5 V, VDD = 12 V VGS = 5 V, VDD = 24 V
Input current (shut down) Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Output capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Over load shut down operation time Note4
Notes: 3. Pulse test 4. Including the junction temperature rise of the over loaded condition.
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 3 of 9
HAF2012(L), HAF2012(S)
Main Characteristics
Power vs. Temperature Derating
80
500
Maximum Safe Operation Area
Thermal shut down 200 Operation area
Pch (W)
ID (A)
60
100 50 20 10 5
20 s
Channel Dissipation
10
DC Op
0
Drain Current
40
20
= er 10 at ion ms (T c= 2 Operation in this area 25 is limited by RDS (on) C 1 )
5 10 20 50 100
PW
1
m
s
s
0 0
50
100
150
200
0.5 Ta = 25C 0.3 0.3 0.5 1 2
Case Temperature
Tc (C)
Drain to Source Voltage
VDS (V)
Typical Output Characteristics
50
10 V 8V 6V
Typical Transfer Characteristics
50
VDS = 10 V Pulse Test
Pulse Test
ID (A)
40
5V
ID (A)
40
Tc = -25C 25C 75C
30
Drain Current
Drain Current
10
4V 3.5 V VGS = 3 V
30
20
20
10
10
0 0
0 2 4 6 8 0 1 2 3 4 5
Drain to Source Voltage
VDS (V)
Gate to Source Voltage
VGS (V)
Drain to Source Saturation Voltage vs. Gate to Source Voltage
Static Drain to Source on State Resistance vs. Drain Current
VDS (on) (V)
Drain to Source on State Resistance RDS (on) ()
2.0
Pulse Test
0.5
Pulse Test 0.2
1.6
Drain to Source Voltage
1.2
0.1
VGS = 4 V
0.8
ID = 20 A 10 A 5A
0.05
10 V
0.4
0.02 0.01 1 2 5 10 20 50 100 200
0 0 2 4 6 8
10
Gate to Source Voltage
VGS (V)
Drain Current
ID (A)
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 4 of 9
HAF2012(L), HAF2012(S)
Static Drain to Source on State Resistance vs. Temperature
Forward Transfer Admittance |yfs| (S)
0.10 Pulse Test ID = 20 A VGS = 4 V 0.06 5A 10 A 100 50
Static Drain to Source on State Resistance RDS (on) ()
Forward Transfer Admittance vs. Drain Current
VDS = 10 V Pulse Test
0.08
20 10 5
Tc = -25C 25C 75C
0.04 5 A, 10 A 10 V
ID = 20 A
0.02
2 1 0.5
0 -40
0
40
80
120
160
1
2
5
10
20
50
Case Temperature
Tc (C)
Drain Current ID (A)
Body-Drain Diode Reverse Recovery Time
Reverse Recovery Time trr (ns)
1000 500 100 50
Switching Characteristics
td(off) tf
Switching Time t (s)
200 100 50 di / dt = 50 A / s VGS = 0, Ta = 25C 1 2 5 10 20 50
20 tr 10 5 td(on)
20 10 0.5
2 1 0.1 0.2
VGS = 5 V, VDD = 30 V PW = 300 s, duty 1 % 0.5 1 2 5 10 20 50
Reverse Drain Current
IDR (A)
Drain Current
ID (A)
Reverse Drain Current vs. Source to Drain Voltage
50 10000 Pulse Test 3000 1000
Typical Capacitance vs. Drain to Source Voltage
Reverse Drain Current IDR (A)
30 VGS = 5 V 20 0V
Capacitance C (pF)
40
Coss 300 100 30 10
10
VGS = 0 f = 1 MHz 0 10 20 30 40 50
0 0 0.4 0.8 1.2 1.6 2.0
Source to Drain Voltage VSD (V)
Drain to Source Voltage VDS (V)
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 5 of 9
HAF2012(L), HAF2012(S)
Gate to Source Voltage vs. Shutdown Time of Load-Short Test
VGS (V)
10 VDD = 36 V 24 V 12 V 9V
Shutdown Case Temperature vs. Gate to Source Voltage
Shutdown Case Temperature Tc (C)
200 ID = 5 A
8
180
Gate to Source Voltage
6
160
4
140
2
120
0 0.1 0.2 0.5 1
100 0 2 4 6 8 10
2
5 10 20
50 100
Shutdown Time of Load-Short Test PW (ms) TTL Drive Characteristics
10 ID = 5 A
Gate to Source Voltage
VGS (V)
1.0
Input Voltage VI (V)
8
0.8
6 VI 4 II
0.6
0.4
2
0.2
0 0.01 0.03
0 0.1 0.3 1 3 10
Gate Series Resistance RG (k) Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance s (t)
3 Tc = 25C 1 D=1 0.5 0.3
0.2
0.1 0.1
0.05
ch - c (t) = s (t) * ch - c ch - c = 2.50C/W, Tc = 25C PDM
p ot uls e
Input Current II (mA)
0.03
0
.02
D= PW T
PW T
0.0
1
h 1s
0.01 10
100
1m
10 m
100 m
1
10
Pulse Width PW (S)
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 6 of 9
HAF2012(L), HAF2012(S)
Test Circuit
RL ID 0 + - VCC =5V II D.U.T VI 0 VI
0
5A
Rg HD74LS08
II
Thermal shut down
Switching Time Test Circuit
Waveform
Vin Monitor D.U.T. RL
Vout Monitor
90% Vin Vout 10% 10% 10%
Vin 5V
50
VDD = 30 V
90% td(on) tr
90% td(off)
tf
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 7 of 9
HAF2012(L), HAF2012(S)
Package Dimensions
Package Name LDPAK(L) JEITA Package Code RENESAS Code PRSS0004AE-A Previous Code LDPAK(L) / LDPAK(L)V MASS[Typ.] 1.40g
Unit: mm
(1.4)
4.44 0.2 10.2 0.3 1.3 0.15
11.3 0.5 0.3 10.0 + 0.5 -
8.6 0.3
1.3 0.2 1.37 0.2
0.76 0.1 2.54 0.5 2.54 0.5
11.0 0.5
0.2 0.86 + 0.1 -
2.49 0.2
0.4 0.1
Package Name LDPAK(S)-(1)
JEITA Package Code SC-83
RENESAS Code PRSS0004AE-B
Previous Code LDPAK(S)-(1) / LDPAK(S)-(1)V
MASS[Typ.] 1.30g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
10.0
(1.5)
(1.5)
2.49 0.2 0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5
0.3 3.0 + 0.5 -
0.2 0.86 + 0.1 -
0.4 0.1
2.54 0.5
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 8 of 9
1.7
1.3 0.15
7.8 6.6
HAF2012(L), HAF2012(S)
Ordering Information
Part Name HAF2012-90L HAF2012-90S HAF2012-90STL HAF2012-90STR Quantity Max: 50 pcs/sack Max: 50 pcs/sack 1000 pcs/Reel 1000 pcs/Reel Shipping Container Sack Sack Embossed tape Embossed tape
REJ03G1139-0400 Rev.4.00 Jul 13, 2007 Page 9 of 9
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
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When exporting the products or technology described herein, you should follow the applicable export control laws and regulations, and procedures required by such laws and regulations. 4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document, please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com ) 5. 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Colophon .7.0


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